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Nanopackaging : nanotechnologies and electronics packaging /
| Altri autori: | |
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| Natura: | Printed Book |
| Lingua: | English |
| Pubblicazione: |
New York :
Springer,
2007.
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| Soggetti: |
Sommario:
- Nanopackaging--Modelling technologies and applications--Application of molecular dynamics simulation--Advances in delamination modeling--Nanoparticle properties--Nanoparticle fabrication--Nanoparticle-based high-k dielectric composites--Nanostructured resistor materials--Nanogranular magnetic core inductors--Nanoconductive adhesives--Nanoparticles in microvias--Materials and technology for conductive microstructures--Study of nanoparticles in SnAg-based lead-free solders--Nano-underfills for fine-pitch electronics--Carbon nanotubes--Characteristics of Carbon nanotubes--Carbon nanotubes for thermal management of microsystems--Electromagnetic shielding of transceiver packaging using multiwall Carbon nanotubes--Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall Carbon nanotubes--Nanowires in electronics packaging--Design and development of stress-engineered compliantinterconnect for microelectronic packaging--Flip chip packaging for silicon logic devices--Nanoelectronic landscape.