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| LEADER |
01861nam a22002535a 4500 |
| 008 |
070711s2007 nyu 000 0 eng |
| 010 |
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|a 2007932733
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| 020 |
|
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|a 9780387473253 (hardcover)
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| 020 |
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|a 9780387473260 (ebook)
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| 082 |
|
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|a 620.5
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| 245 |
0 |
0 |
|a Nanopackaging :
|b nanotechnologies and electronics packaging /
|c [edited by] James E. Morris.
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| 260 |
|
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|a New York :
|b Springer,
|c 2007.
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| 300 |
|
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|a xxi,543p. ;
|c 24 cm.
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| 505 |
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|a Nanopackaging--Modelling technologies and applications--Application of molecular dynamics simulation--Advances in delamination modeling--Nanoparticle properties--Nanoparticle fabrication--Nanoparticle-based high-k dielectric composites--Nanostructured resistor materials--Nanogranular magnetic core inductors--Nanoconductive adhesives--Nanoparticles in microvias--Materials and technology for conductive microstructures--Study of nanoparticles in SnAg-based lead-free solders--Nano-underfills for fine-pitch electronics--Carbon nanotubes--Characteristics of Carbon nanotubes--Carbon nanotubes for thermal management of microsystems--Electromagnetic shielding of transceiver packaging using multiwall Carbon nanotubes--Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall Carbon nanotubes--Nanowires in electronics packaging--Design and development of stress-engineered compliantinterconnect for microelectronic packaging--Flip chip packaging for silicon logic devices--Nanoelectronic landscape.
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| 650 |
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|a Nanotechnology
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| 650 |
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|a Nanoparticles
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| 650 |
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|a Packaging
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| 700 |
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|a Morris,James E.
|e Edditor.
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| 942 |
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|c BK
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| 263 |
|
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|a 0711
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| 906 |
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|a 0
|b ibc
|c orignew
|d 2
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|f 20
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|a pc17 2007-07-11
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| 999 |
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|c 96253
|d 96253
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|r 2012-10-28
|v 6441.44
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