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Practical guide to the packaging of electronics: thermal and mechanical design and analysis
主要作者: | |
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格式: | Printed Book |
語言: | English |
出版: |
New York
Marcel Dekker
2003
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主題: |
UL
索引號: |
621.39:004.3'142 JAM |
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復印件 | Live Status Unavailable |