Á lódáil...
Microelectronics interconnection and packaging
| Príomhúdar: | |
|---|---|
| Formáid: | Printed Book |
| Teanga: | English |
| Foilsithe: |
New York
McGraw-Hill
1980
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| Ábhair: |
| Cur Síos ar an Mír: | |
|---|---|
| Cur Síos Fisiciúil: | vii, 320p. |